spec no: dsad1207 rev no: v.1 date: apr/25/2003 page: 1 of 4 approved : j. lu checked : allen liu drawn: d.h.fang notes: 1. all dimensions are in millimeters (inches).2. tolerance is 0.2(0.008") unless otherwise noted. 3. specifications are subject to change without notice. features l low power consumption. l 3.0mmx3.0mm smt led, 2.0mm(max.) thickness. l one orange chip in one package. l can produce any color in visible spectrum, including white light. l package : 1000pcs / reel. package dimensions 3.0mmx3.0mm surface mount led lamp apkf3030sexxc/e hyper orange description the hyper orange source color devices are made with dh ingaalp on gaas substrate light emittingdiode.
spec no: dsad1207 rev no: v.1 date: apr/25/2003 page: 2 of 4 approved : j. lu checked : allen liu drawn: d.h.fang selection guide absolute maximum ratings at t a =25 c note: 1. 1/10 duty cycle, 0.1ms pulse width. note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. electrical / optical characteristics at t a =25 c l o b m y slo bm y s l o b m y s l o b m y slo bm y sre te m a r a pre te m a r a p r e t e m a r a p r e t e m a r a pre te m a r a pec iv e dec iv e d e c i v e d e c i v e dec iv e d.p yt . p y t . p y t . p y t.p y t.x am . x a m . x a m . x a m.x a mst in u st i n u s t i n u s t i n ust in usn oi t i d n o c t s e tsn oi t i d n o c t s e t s n o i t i d n o c t s e t s n o i t i d n o c t s e tsn oi t i d n o c t s e t k a e p h t g n e l e v a w k a e peg na r o r e p y h03 6mni f a m 0 2 = d h t g n e l e v a w e t a n i m o deg na r o r e p y h12 6mni f a m 0 2 = ? 2 / 1 h t d i w - f l a h e n i l l a r t c e p seg na r o r e p y h02mni f a m 0 2 = cec na t i c a p a ceg na r o r e p y h52fpv f z h m 1 = f ; v 0 = v f e g a t l o v d r a w r o feg na r o r e p y h0. 25. 2v i f a m 0 2 = i r t n e r r u c e s r e v e reg na r o r e p y h01auv r v 5 = r e t e m a r a pre te m a r a p r e t e m a r a p r e t e m a r a pre te m a r a peg na r o r e p y heg na r o r e p y h e g n a r o r e p y h e g n a r o r e p y heg na r o r e p y hst in u st i n u s t i n u s t i n ust in u n o i t a p i s s i d r e w o p05 1wm t n e r r u c d r a w r o f c d03am ] 1 [ t n e r r u c d r a w r o f k a e p59 1am e g a t l o v e s r e v e r5v e r u t a r e p m e t e g a r o t s / g n i t a r e p o04 - 5 8 + o t c c . o n t r a p.o nt r a p . o n t r a p . o n t r a p.o nt r a pec id ec i d e c i d e c i dec i dep yt s n e lep yt s n e l e p y t s n e l e p y t s n e lep yt s n e l ) d c m ( v i)d cm ( v i ) d c m ( v i ) d c m ( v i)d cm ( v i a m 0 2 @ g n i w e i vgn iw e i v g n i w e i v g n i w e i vgn iw e i v e l g n a . n i m.n i m . n i m . n i m.n i m.p yt . p y t . p y t . p y t.p y t 2 / 1 22/ 1 2 2 / 1 2 2 / 1 22/ 1 2 e / c x x e s 0 3 0 3 f k p a)p la a g n i ( e g n a r o r e p y hra el c r e t a w08 100 4 0 01
spec no: dsad1207 rev no: v.1 date: apr/25/2003 page: 3 of 4 approved : j. lu checked : allen liu drawn: d.h.fang hyper orange apkf3030sexxc/e
spec no: dsad1207 rev no: v.1 date: apr/25/2003 page: 4 of 4 approved : j. lu checked : allen liu drawn: d.h.fang recommended soldering pattern (units : mm) apkf3030sexxc/e smt reflow soldering instructions number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process. tape specifications (units : mm)
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